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Reflow soldering requires solder paste (a suspension of
one operation within 2 to 5 seconds between
fine solder particles, flux and binding agent) to be applied
270 and 320 C.
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250 C.
15.3 Wave soldering
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
CAUTION
Wave soldering is NOT applicable for all QFP
packages with a pitch (e) equal or less than 0.5 mm.
1998 Nov 02 51
Philips Semiconductors Product specification
Disk drive spindle and VCM with
OM5193H
servo controller
16 DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
17 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Nov 02 52
Philips Semiconductors Product specification
Disk drive spindle and VCM with
OM5193H
servo controller
NOTES
1998 Nov 02 53
Philips Semiconductors Product specification
Disk drive spindle and VCM with
OM5193H
servo controller
NOTES
1998 Nov 02 54
Philips Semiconductors Product specification
Disk drive spindle and VCM with
OM5193H
servo controller
NOTES
1998 Nov 02 55
Philips Semiconductors a worldwide company
Argentina: see South America Middle East: see Italy
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Tel. +31 40 27 82785, Fax. +31 40 27 88399
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Belgium: see The Netherlands Pakistan: see Singapore
Brazil: see South America Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
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Tel. +852 2319 7888, Fax. +852 2319 7700
Tel. +7 095 755 6918, Fax. +7 095 755 6919
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Tel. +91 22 493 8541, Fax. +91 22 493 0966 Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division, Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
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Ireland: Newstead, Clonskeagh, DUBLIN 14, 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +353 1 7640 000, Fax. +353 1 7640 200 Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
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Tel. +82 2 709 1412, Fax. +82 2 709 1415 Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Uruguay: see South America
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Vietnam: see Singapore
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Tel. +9-5 800 234 7381
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